Home » New Tenders » Procurement of 0722-214FE2944SCF Procurement of wafer bonding and double-sided alignment exposure equipment (second)(2) New Tenders Time:2022-01-14

https://www.chinabidding.com/en/detail/251483788-BidNoticeEn.htmlProcurement of 0722-214FE2944SCF Procurement of wafer bonding and double-sided alignment exposure equipment (second)(2)

New Tenders

Time:2022-01-14China Far East International Tendering Co.,LTD entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2022-01-14
1、Bidding Conditions
Overview:The wafer bonding machine and double-sided alignment exposure machine are approved for the construction of magnetic micronano platform
Source of Funds:Self-owned funds, the funds have been implemented
Description of The Prepared Bidding Conditions:Has the
2、Bidding Content
Bidding No:0722-214FE2944SCF
Project Name:Procurement of wafer bonding and double-sided alignment exposure equipment (second)
Place of Implementation:No.268, West Section of North Binhe North Road, Fucheng District, Mianyang City,
List of Products:

NO. Product Name Quantity Main Technical Data Remarks
num. one The wafer bonding machine num. one 1. Bond the pressure control:
* Piston pressure of 60kN;
* Pressure control accuracy: ± 2% or ± 300N;
2. Bond the temperature control:
Temperature control method: upper and lower pressure head;
* Heimum temperature range: 500℃;
* Temperature control accuracy: ± 1℃;
* Temperature uniformity of pressure head: ± 1.5%;
The 3.6-inch pressure plate material is silicon nitride
two Double-sided alignment of the exposure machine num. one * 1. LED light source as exposure source with 364nm and 405nm + 436nm, controlled light intensity, exposure area of 150mm and 4% consistency within 150mm; LED light source shall operate smoothly for at least three years or 5,000 hours;
* 2. The optical alignment module is suitable for 0.1-2mm thickness wafer, adjustable separation distance of 0-300 m, front alignment accuracy ± 0.5 m, back alignment accuracy soil 1 m, and bonding alignment precision 2 m
* 3. The alignment system can match the chuck module of the corresponding type;
* 4. The top and bottom are equipped with high score CCD camera, 25X objective, 59mm Y ± 59 m m; 2 bottom camera Y ± 10mm; not less than 2 x and 4 x.

3、Qualification Requirements For Bidder
Qualifications or Performance:3.1 For foreign and overseas enterprises, provide relevant certificates registered at the address of the major manufacturers according to the laws of the country (region); for domestic enterprises, provide a copy of the business license of the enterprise legal person;
3.2 If the Bidder is an agent, the bidder shall obtain the only formal special authorization of the manufacturer or the general agent with the authorization of the manufacturer or the general agent of the manufacturer) to ensure the integrity of the authorized chain to participate in the bid.
3.3 Bank credit certificate issued by the account opening bank of the bidder within three months before the bid opening.
3.4 The Bidder or the manufacturer shall provide statements of no major engineering accidents and no complaints of major after-sales service problems, and shall provide at least one performance of the same model or structural equipment since 20 November 2018, and other supporting documents (contract or acceptance certificate (with the user\’s seal).)
3.5 Consortium bidding is not accepted for the project.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2022-01-17
Ending of Selling Bidding Documents:2022-01-24
Sell bidding?doc?online?or?not:No
To Obtain::On-site Purchase
Place:(1) Online acquisition: purchase and download the bidding documents on the
Price of Bidding Documents:¥800/$125
Additional Instructions:(1) Online acquisition: purchase and download the bidding documents on the \”Joint Bidding and Procurement Platform\” (website http://www.365trade.com.cn/) within the release time of bidding documents (00 to 23:59 minutes and 59 seconds).The platform consultation telephone number is: 010-86397110. (2) The site access: in the bidding documents sale time (0930 am to 12 every day, 14 to 17 PM, except national holidays) with valid copy of the business license (unit seal) and enterprise legal person power of attorney and authorized representative id card scan (, with unit seal) to Chengdu high-tech zone should long nan road 555 is cheng south county 1 building 19 [. China Far East International Tendering Co., Ltd. Sichuan Branch] obtained the bidding documents.Through the \”joint bidding procurement platform\” for bidding documents, also need to pay trading platform service fee 200 yuan / package, bidding documents fee, trading platform service fee is not refund (bidding documents after not refund, bidding qualification cannot be transferred, the bidding invitation only through the bidding documents, the acquisition method is valid).
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2022-02-11 10:30
Place of Bid:Bid Opening Room of this project, No.19, Building 1, Zhengchengnan, No.555, Yinglong South Road, Chengdu High-tech Zone
Place of Bid Opening:Bid Opening Room of this project, No.19, Building 1, Zhengchengnan, No.555, Yinglong South Road, Chengdu High-tech Zone
6、The bidder needs to register before the tender on www.chinabidding.com. And the evaluation results will be released on www.chinabidding.com.
7、Contact Details
Purchasers:Southwest Institute of Applied Magnetics of China
Add.:No.268, West Section of North Binhe North Road, Fucheng District, Mianyang City, Sichuan Province
Contact:Bidding contact person: Mr.He, bidding technology
Tel:13989281851、18981192585
Bidding Agency:China Far East International Tendering Co.,LTD
Add.:No.19, Building 1, Chengcheng County, 555, Yinglong South Road, Chengdu High-tech Zone
Contact:Teacher wang
Tel:15104286116
8、Remittance Approach:
Bank(RMB):ICBC Beijing Heping Street Sub-branch
Bank(USD):ICBC Beijing Heping Street Sub-branch
Account NO.(RMB):0200205319200005445
Account NO.(USD):0200205319200005445
Additional:Overseas bidders shall apply to the following bank information:
Bank information of the tendering agency:
Bank: ICBC Beijing Heping Street Sub-branch
Address: Heping Street Shopping Mall, Building 5, District 10, Heping Street, Chaoyang District, Beijing
Line No.: 102100020534
Swift code:ICBKCNBJBJM
Account number: 0200205319200005445
Account name: China Far East International Bidding Co., Ltd
Domestic bidders are applicable to the following bank information:
Bank information of the tendering agency:
Account name: China Far East International Bidding Co., Ltd
Bank: Beijing Yuquan Sub-branch
Account number: 6232810010000201063
Note: If the bid security is submitted by wire transfer or online bank, the project name and bidding number are indicated in the appendix column.

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